X-Meritan ialah pembekal Bahan Termoelektrik Terekstrusi berkualiti China profesional. Bahan termoelektrik jenis mampatan, sebagai teras sistem pengurusan haba berprestasi tinggi semasa, telah menjadi bahan asas pilihan untuk modul Peltier ultra-miniatur berkat kejayaan mereka dalam teknologi pengeluaran jongkong 25-35 mm berdiameter besar. Melalui proses ubah bentuk plastik tekanan tinggi, X-Meritan yang berpangkalan di China memastikan Jongkong Termoelektrik Tersemperit Kekuatan Tinggi ini mempunyai kekuatan mekanikal yang sangat tinggi dan keseragaman elektrik haba, menyediakan asas kawalan suhu yang boleh dipercayai untuk komunikasi optik ketepatan dan peralatan perubatan.
Bahan Termoelektrik Terekstrusi oleh X-Meritan telah menunjukkan kelebihan yang tiada tandingan dalam teknologi penyejukan semikonduktor moden. Khususnya, proses penyemperitan berdasarkan penyelesaian pepejal Bi2Te3-Sb2Te3 telah menangani sepenuhnya kekurangan bahan lebur tradisional, seperti kerapuhan dan pemprosesan terhad. Bahan Termoelektrik Bi2Te3-Sb2Te3 untuk modul peltier ini bukan sahaja mempunyai sifat termoelektrik yang setanding dengan kaedah lebur zon, tetapi juga, disebabkan teksturnya yang sangat baik, membolehkan pembuatan modul cip ultra-nipis dengan ketebalan hanya 0.2 mm, memenuhi keperluan ketat untuk pelesapan haba ketumpatan kuasa tinggi dalam era 5G.
Extruded Thermoelectric Materials (TEM), especially Bi2Te3-based alloys, is used to manufacture high-performance, fine-grained semiconductors with a textured and dense structure. This method can enhance mechanical strength, reduce thermal conductivity, and improve figure of merit ZT.
- Panjang: 120 mm, 240 mm
- Diameter: 25 mm, 30 mm, 35 mm
- Kekonduksian elektrik: 870-1430 Ohm-1cm-1
|
Hartanah |
P |
N |
|
Kekuatan Mampatan (MPa) |
54.0 |
66.0 |
|
Kekuatan Ricih (MPa) |
16.0 |
21.0 |
|
Modul Muda (GPa) |
47.0 |
42.0 |
|
Nisbah Poisson |
0.30 |
0.30 |
|
Suhu |
Sepanjang arah penyemperitan |
Merentasi arah penyemperitan |
||
|
N |
P |
N |
P |
|
|
-25C |
10.2 |
10.6 |
12.5 |
10.8 |
|
+50C |
13.3 |
14.0 |
16.6 |
18.0 |
|
+150C |
15.5 |
15.8 |
18.3 |
19.9 |
● Bahan Termoelektrik Terekstrusi mempunyai sifat mekanikal yang sangat tinggi, membolehkan penghasilan modul cip ultra-nipis dengan ketebalan hanya 0.2 milimeter.
● The solid structure is stable, with no moving parts during operation, achieving a completely silent and vibration-free working environment.
● The material has a high degree of texture and uniformity, with an electrical conductivity range of 870-1430 Ohm-1cm-1, ensuring consistent performance.
● The response is rapid and the temperature control is precise. Instant switching between heating and cooling can be achieved simply by changing the current direction.
● The thermoelectric performance is outstanding, with a thermoelectric figure of merit of up to 2.9x10-3 C in a 25°C vacuum environment, comparable to or even superior to that of regional melting materials.
● The integrated chip-level design has an extremely small overall size and light weight, meeting the high-density layout requirements of modern electronic devices.
● Environmentally friendly, the product manufacturing fully complies with the RoHS standard, and does not contain harmful chemicals to the environment.
● Kebolehpercayaan fizikal adalah sangat tinggi. Ubah bentuk plastik tekanan tinggi menghapuskan kecacatan dalaman, memastikan prestasi tidak merosot di bawah kitaran sejuk dan panas jangka panjang.
1. Micro TEC Manufacturing: Provides high-strength substrates to support the fabrication of extremely thin electrical pairs required in the optical communication field.
2. Multi-stage TEC assembly: Utilizing extremely high consistency, it meets the requirement of highly synchronized performance of each layer of thermoelectric elements for the multi-stage stacked structure.
3. High-power industrial TEC production: With the use of large-diameter ingot specifications, the production efficiency of large-sized heat sinks is enhanced, and the unit cost is reduced.
4. Kawalan suhu ketepatan Modul Peltier: Berdasarkan formula kekonduksian yang tepat, ia menghasilkan komponen penyejukan khas yang sesuai untuk keperluan kawalan suhu gred penyelidikan.
5. High-reliability Medical TEC: Supports the manufacturing of high-performance medical refrigeration chips that can withstand tens of thousands of cold and hot cycles.
1. Materials prepared by the traditional Bridgman method often have the problem of the cleavage surfaces being prone to peeling. Our Extruded Thermoelectric Materials enhance the intergranular bonding force through plastic deformation. This means that during the later slicing and thinning processes, the material can withstand extremely high mechanical stress, enabling the production of micro TEC components with a thickness of only 0.2 mm without generating micro cracks.
2. The stability of performance brought by high texture through stress-induced processes during the extrusion process ensures that the electrical and thermal properties of each batch of rods in mass production have extremely small deviations. For Permalloy modules that require multiple series connections, the consistency of the material directly determines the lifespan and temperature control accuracy of the system.
3. The efficiency of optimizing Bi2Te3 - Sb2Te3 thermoelectric materials for Permalloy modules is highly efficient in a vacuum environment of 25 degrees Celsius. This material exhibits excellent cooling coefficient (COP). Its thermoelectric merit value (Z value) is in the first tier of global commercial materials, effectively reducing power consumption of optical modules and lasers during long-term operation.
In China, we look forward to establishing a solid cooperative relationship with you and jointly promoting the realization of technological innovation by leveraging our N-Type Extruded Thermoelectric Materials. Welcome to hubungi kamidan lawati X-Meritan dengan segera dan bekerjasama dengan kami untuk menggunakan teknologi penukaran termoelektrik yang cekap untuk berlatih dan mencipta nilai bersama.
